Component module for piggyback mounting on a circuit package having dual-in-line leads

ABSTRACT

A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP. In one component module embodiment (15, FIG. 1), the terminals (26-29) are adapted for soldered securement to a circuit board (54), whereas in a second embodiment (70, FIG. 6) the terminals (76-79) are adapted to be snap-locked on and, thereafter, soldered to, upper horizontal shoulder portion (82a) of respectively aligned leads (82) of a supporting DIP (81).

FIELD OF THE INVENTION

This invention relates to integrated circuit assemblages and, moreparticularly, to a component module, including a decoupling capacitor,adapted to be piggyback mounted on, and electrically interconnected withonly selected leads of, an integrated circuit package of the type havingdual-in-line leads.

BACKGROUND OF THE INVENTION

In complex microelectronic circuitry, a plurality of integrated circuitpackages with dual-in-line leads, generally referred to simply as"DIPs", are normally employed. These circuit packages may incorporatediverse types of integrated digital devices, such as in the form ofmemories, operational amplifiers, multivibrators, flip-flops, etc.

Regardless of their logic function, these circuit packages, as typicallyemployed in a composite utilization circuit, normally individuallyrequire a so-called decoupling capacitor connected between the batteryand ground leads thereof. In most DIPs having standard pin-outs rangingfrom 14-22 leads, the battery and ground leads are respectively chosento be an end lead in one row and the diagonally disposed end lead in theother row thereof. The capacitors are primarily employed to absorb and,thereby, smooth out the detrimental surges of current, and attendantvoltage drops, that would otherwise be applied to the DIPs (because oftheir inherently resistive input load characteristics) each time theywere initially energized. Such decoupling capacitors also function aseffective low pass filters to minimize high frequency transient noisethat is often generated as a result of the exceedingly high speeds atwhich most DIPs switch operating state.

The use of discrete, circuit board-mounted decoupling capacitors isnormally not desirable, not only because board space is often at apremium, but because of the necessary appreciable lengths of theinterconnections between the capacitor and an associated DIP. This canoften result in increased values of effective series resistance andinductance that can actually nullify the intended decoupling function ofthe capacitor. Additionally, decoupling capacitors with conventionalleaded electrodes normally present appreciable series resistance toinduced current in the form of high frequency transient type noise, thusreducing the effectiveness of such a capacitor as a low pass filter.This follows from the fact that the effective resistance of a conductoncarrying a very high frequency current varies inversely with the surfacearea rather than the mass of the conductor.

One approach taken heretofore to overcome the above-mentioned problemsrelating to the use of board-mounted decoupling capacitors has been toincorporate the capacitor in a specially constructed socket of the typedisclosed in J. A. Lockhart, Jr. U.S. Pat. No. 3,880,493. Morespecifically, the capacitor is not only embedded in, but the dielectriclayers thereof are formed out of the same material used to form, thesocket. The lead-out contacts of the capacitor are respectively securedto different connectors which form an integral part of the socket. Theconnectors are spaced apart and adapted to respectively receive thebattery and ground leads of a socket-mounted DIP, while nested withinrespectively aligned thru-holes of a circuit board.

While a properly constructed capacitor in such an interfacing socketcould perform an effective decoupling function, there is no practicalway to replace only the capacitor, should it become defective, withouthaving to replace the entire composite socket. This would prove quitecostly, as the capacitor itself would normally constitute a very smallpercentage of the total cost of the socket. This would particularly bethe case if precious metal contact areas were plated on the innersurfaces of the socket connectors so as to establish reliable solderlessconnections therebetween. It is because of this last-mentioned expense,in particular, that sockets, in whatever form, have in many cases notbeen preferred over the far less costly technique of directly mountingand solder-connecting IC DIPs to a circuit board.

There has thus been a need for a simplified, reliable and inexpensiveway to interconnect a decoupling capacitor to the battery and groundleads of either a circuit board or socket-mounted DIP, with minimaleffective series resistance and inductance being established by suchinterconnections, and with no additional board or socket space beingrequired for the capacitor. In addition, in many integrated circuitapplications, wherein a large number of relatively high power integratedcircuits of the DIP type are employed, there has also been a need for aheat sink that could be incorporated as part of a composite decouplingcapacitor-DIP assemblage.

SUMMARY OF THE INVENTION

A component mddule, adapted for piggyback mounting on an IC DIP, isformed with a component, such as a flat rolled film capacitor withmetallic end electrodes, encapsulated within a molded housing ofpreferably parallelepiped configuration. The electrodes are uniquelyconnected to only two of preferably four rectangularly shaped terminalsthat project downwardly from different corners of the housing. The twoterminals connected to the capacitor electrodes are uniquely diagonallydisposed and spaced as to respectively engage, and bias against, thebattery and ground leads of a standard pin-out DIP, when the componentmodule is piggyback-mounted thereon. The other two diagonally disposedterminals of the circuit module are electrically isolated from thecapacitor, being employed only to facilitate the piggyback mounting ofthe component module on an associated DIP, and to maintain the latter inthe proper position until permanently secured to the supporting DIPthrough soldered connections.

In one of several preferred component module embodiments, the terminalsare dimensioned to overlie and extend coextensively with therespectively mating DIP leads through aligned solder-connectingthru-holes of a circuit board, for example. In a second preferredcomponent module embodiment, the terminals thereof are bifurcated andadapted to be snap-locked on and, thereafter, soldered to, thehorizontal shoulder portions of the respectively associated leads of asupporting DIP.

With the preferred component module structured and piggyback-mounted ona DIP as described above, it is seen that the interconnections will addminimal effective series resistance and inductance to the circuitassemblage.

In accordance with a preferred method of fabricating the describedcomponent module embodiments, the four terminals thereof are preferablyformed out of a lead frame type of strip stock carrier. Such a carrierreadily allows the upper portion of the two diagonally disposedterminals that are ultimately solder-connected to the capacitorelectrodes to be pre-formed with uniquely configured brackets. They areadapted to both support and make elevational contact with theelectrode-defined end portion of the capacitor.

An optional modification of the preferred component module embodiments,and of the methods for their fabrication, relates to a heat sink whichmay be fabricated out of the same strip stock carrier employed to formthe terminals, and may either be partially embedded in, or completelyencapsulated by, the molded housing while positioned beneath thecapacitor. Such a heat sink may also be employed to function as aneffective shield against electromagnetic radiation or interference ifmade out of, or coated with, a suitable energy-dampening material.

DETAILED DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view, partially in section, of one preferredembodiment of a component module incorporating a decoupling capacitor,and illustrates the manner in which it is encapsulated andterminal-connected, and further illustrates, in phantom, an optionalheat sink that may be fabricated as part of the circuit module inaccordance with the principles of the present invention;

FIG. 2 is a fragmentary perspective view of a strip stock carrier out ofwhich the fabricated component module terminals of FIG. 1, as well as anoptional heat sink, may be formed prior to the capacitor, shown only inphantom, for clarity, being encapsulated within the molded housing, withupper horizontal leg portions of the terminals, and a major centralportion of the optional heat sink, being simultaneously embeddedtherein, in accordance with the principles of the present invention;

FIG. 3, in simplified cross-sectional form illustrated the upper andlower halves of a transfer mold applicable for use in forming the moldedhousing of the component module of FIG. 1;

FIG. 4 is a perspective view of the component module of FIG. 1 afterhaving been piggyback-mounted on, and interconnected to, an associatedintegrated circuit of the DIP type, with such composite assemblage beingfurther shown as typically mounted on, and solder-connected to, anassociated illustrative printed circuit board;

FIG. 5 is a fragmentary elevational end view, partially in section,taken along the line 5--5 of FIG. 4, showing in greater detail therelationship between one terminal of the component module and an alignedand mating underlying lead of an associated supporting DIP, as assembledand solder-connected to the circuit board of FIG. 4;

FIG. 6 is a perspective view of a second preferred component moduleembodiment which is distinguished from the embodiment of FIG. 1 by themanner in which the terminals are constructed, and adapted, forinterconnection with the horizontal shoulder portions of respectivelyaligned leads of a DIP;

FIG. 7 is a fragmentary perpsective view illustrating in greater detailthe construction of the downwardly extending bifurcated end region ofone representative terminal of the component module of FIG. 6;

FIG. 8 is a perspective view of the component module of FIG. 6 afterhaving been piggyback-mounted on, and interconnected to, an associatedDIP prior to such a composite assemblage being mounted on, andsolder-connected to, an associated illustrative circuit board;

FIG. 9 is a fragmentary elevational end view, partially in section,illustrating in greater detail the solder-connected relationship betweenone terminal of the component module of FIG. 6, the upper shoulderportion of an aligned lead of an associated supporting DIP, and thesupporting circuit board depicted in FIG. 8; and

FIG. 10 is a fragmentary perspective view of a modified terminal bracketadapted to receive a leaded end of a component, such as the illustrativecapacitor, with the lead preferably being soldered to the bracket priorto the capacitor being encapsulated within a molded housing, as depictedin FIGS. 1 and 6.

DETAILED DESCRIPTION OF THE INVENTION

It should be appreciated that while the invention is described in detailherein primarily in regard to mounting a decoupling capacitor module ina piggyback manner on an integrated circuit having dual-in-line leads(of the DIP type), and simultaneously effecting the desiredinterconnections therebetween, it should be understood that other typesof discrete components or devices, such as resistors, miniaturizedrelays, fuses, diodes and the like could be similarly encapsulated in amolded component housing and interconnected through the terminalsthereof to selected leads of an associated DIP for a specific circuitfunction.

With particular reference to FIG. 1, there is illustrated one preferredcomponent module embodiment 15 including a flat rolled metallized filmcapacitor 18 encapsulated within a molded housing 21. Also forming partof the fabricated component module 15 are four downwardly extendingterminals 26-29, each being secured to the housing 21 at a differentcorner region thereof. As best seen in FIG. 2, only the diagonallydisposed terminals 27 and 29 are respectively connected to endelectrodes 23 and 24 of the capacitor 18.

In the illustrative capacitor 18, as fabricated, the electrodes 23, 24are solder-coated and formed as end extensions of the body portion ofthe capacitor. It should be understood, of course, that many other typesof capacitors, such as ceramic capacitors, and with or without leads,could also be employed for the capacitive decoupling purpose of primaryconcern herein. Regardless of type, the capacitor could also have atubular, rectangular, or essentially oval, as well as flat,cross-section. It is normally desirous, however, that the chosencapacitor have minimal thickness, so that the component module will havea relatively low profile.

With respect to the molded housing 21, it may be formed out of anysuitable plastic material, one such material being sold by the HysolCompany under the code number MG8F, for use in a transfer moldingprocess. The latter process is particularly applicable for molding thehousing 21, for reasons described hereinbelow in connection with adescription of a preferred method of fabricating the composite componentmodule. It should be understood, however, that the molded housing 21could also be formed by other molding processes, including the pottingof the terminal-connected capacitor.

Considering now the construction and positioning of the terminals 26-29more specifically, they are preferably initially fabricated out of alead frame type of strip stock carrier 33, illustrated in FIG. 2. Asshown therein, in solid line form, the partially blanked out terminal 26is formed with an upper inwardly and horizontally disposed leg portion26a that is isolated from a similarly disposed leg portion 29a, of theterminal 29, by a blanked out slot 36. In a similar manner, an upperhorizontally disposed leg portion 28a of the terminal 28 is electricallyisolated from a mutually disposed horizontal leg portion 27a of theterminal 27 by a blanked out slot 38.

All four terminals are, of course, ultimately severed from thelongitudinally disposed strip stock carrier rails (or dam bars) 41 and42, as indicated by the blank-out lines 41a and 42a shown in dash-lineform in FIG. 2. During the final blank out of the terminals 26-29, andin preparation for the encapsulation of the terminal-connected capacitor18, the outer end regions of the terminals, preferably while still in acommon plane, would be clamped by suitable fixturing (not shown) in awell-known manner.

Electrical contact between the capacitor electrodes 23 and 24 and therespective terminals 27 and 29 are established in the first illustrativeembodiment by forming each of the latter, while in planar strip carrierform with not only the aforementioned inwardly and horizontally disposedleg portions 27a or 29a, but with respective outwardly extending legportions 27b or 29b. As shown in phantom line form in FIG. 2, each ofthe oppositely directed leg portions 27b and 29b are ultimately bentinto a substantially C-shaped bracket 27c or 29c, through the use ofsuitable fixturing (not shown). Such fixturing may be either automatedor manually operated, but forms no part of the present invention.

The formed brackets 27c and 29c, in addition to effecting reliablecontact with the capacitor electrodes, provide the means for supportingand positioning the capacitor prior to the encapsulation thereof withinthe molded housing 21. Notwithstanding the resilient, frictional contactestablished between the brackets and the respective capacitorelectrodes, it may be desirable in certain applications to alsoestablish permanent soldered connections therebetween. Such connectionsare facilitated, for example, by fabricating the capacitor withsolder-coated electrodes.

While a single C-shaped bracket 27c or 29c is illustrated as being incontact with each of the capacitor electrodes, it is obvious that two ormore laterally spaced brackets could be employed, if desired, for aparticular application. It is also understood that a flat capacitor ofthe type illustrated could be supported by a plurality of tangs, such asthree (not shown), wherein the middle tang could be bent at apredetermined angle downwardly, for example, relative to the major planeof the strip carrier depicted in FIG. 2, with the two outer tangs bentat a corresponding, but oppositely inclined, angle upwardly so as toaccommodate an electrode end portion of the capacitor within thevertices thereof.

Concomitantly, the C-shaped brackets 27c and 29c illustrated in FIGS. 1and 2 could also be readily replaced by two upwardly extending ears (notshown) with either flat or arcuate surfaces, so as to nest body endportions of either a leaded or leadless capacitor (or any othercomponent or device) therewithin. With respect to leaded components, analternative L-shaped bracket 42, of the type depicted in FIG. 10, wouldnormally be desired in addition to any other terminal-formed membersadapted only to support body portions of a capacitor (or any othercomponent). With such an L-shaped bracket, having a centrallead-receiving slot 42a, a capacitor 44, for example, having axialdisposed leads 46 (only one seen in FIG. 10), may be both readilysupported by, and solder-connected to, the bracket 42. This type ofbracket, of course, by itself is applicable for use in supportingdiverse types of leaded components or devices, having variouscross-sectional configurations.

In the illustrative embodiment of FIG. 1, the diagonally disposedterminals 26 and 28, as previously noted, are not electrically connectedto the capacitor electrodes 23, 24. As such, they are employed only tofacilitate the piggyback mounting of the component module 15 on anassociated integrated circuit DIP 51, which, in turn, is mounted on acircuit board 54, as depicted in FIG. 4. In this regard, it should beappreciated that the component module 15 could be employed with only thetwo capacitor-connected leads 27 and 29, particularly if the module wasto be mounted on a DIP only after the latter had been mounted on, butnot yet solder-connected to, a circuit board. With the component module15 mounted on the DIP 51, as illustrated in FIG. 4, it is seen that theterminals 26-29 (only three being seen) respectively overlie differentones of only the end leads, commonly identified by the reference numeral53, of the DIP 51. By way of example only, in FIG. 4 the diagonallydisposed terminals 27 and 29 are chosen to be in mating contact with therepresentative battery and ground leads, respectively, of the DIP 51.

The terminals 26-29 are preferably formed out of a suitable material,such as so-called full hard solder-plated brass, commercially availablefrom a number of sources in various widths and thicknesses, in stripstock form. Such material exhibits not only good conductivity, butresiliency. This insures that the terminals will always reliably biasagainst the outer surfaces of the respectively aligned leads 53 of anassociated DIP, and remain frictionally secured thereto untilpermanently solder-connected. As such, the component module 15 may bepiggyback-mounted on a DIP, either before or after the latter has beenmounted on the circuit board 54. At that time, not only the leads of theDIP 51, but the selectively mating terminals 26-29 of the componentmodule 15, extend through the respectively aligned thru-holes 56 of thecircuit board, as depicted in FIGS. 4 and 5. Thereafter, reliablepermanent soldered connections 57 (only one seen in FIG. 5) may beestablished between the DIP leads 53, terminals 26-29, and therespectively associated land areas or pads 58 formed on the underside ofthe circuit board 54. Such soldered connections are preferably effectedwith a conventional wave soldering machine.

As an optional modification of the one preferred illustrative embodimentof FIG. 1, there is shown in phantom-line form a heat sink 61, thecentral planar portion 61a of which is positioned beneath the centralbody portion of the capacitor 18, and also embedded within the moldedhousing 21 of the module 15. The illustrative heat sink is also formedwith two L-shaped exposed portions 61b, 61c so as to provide a greatermass and surface area. Such a heat sink is of particular advantage inlarge electronic systems where a number of the DIPs employed are of theso-called high power type. Such DIPs inherently generate appreciableamounts of heat, and often require external cooling unless some form ofclosely spaced heat sinks are provided. The heat sink 61, as previouslymentioned, may also function as an effective shield againstelectromagnetic radiation or interference, if made out of, or coatedwith, a suitable material for that purpose.

As seen in FIG. 2, the heat sink 61 may be readily fabricated out of thesame strip stock carrier 33 employed to form the terminals 26-29. Inthat event, it is obvious that the carrier guide rails (or dam bars) 41and 42 would be severed therefrom, in the same manner as described abovewith respect to the terminals 26-29, prior to the capacitor, horizontalleg portions of the terminals and at least the central portion of theheat sink being encapsulated within the molded housing 21.

In accordance with a method of fabricating the component module 15 ofFIG. 1, reference is made to FIG. 3 which, in simplified form,illustrates a two-piece transfer mold 65 for forming the module housing21. Such a mold is employed after all of the blanking operations, andthe bracket forming operations, have been performed on the strip stockcarrier 33, but before the terminal and optional heat sink bendingoperations, as illustrated in FIG. 2.

More specifically, the upper and lower mold sections 66a, 66b aredimensioned such that when properly positioned and closed, the twolongitudinally disposed carrier rails 41 and 42 are each clamped betweenthe associated one of the two longitudinally disposed and interfacingmold sections that define a parting line. The inner edges of each of thetwo laterally disposed and interfacing mold sections that define aparting are preferably located very close to the associated one of theparallel extending outermost edges of the terminal leg portions 26a, 29a, or 27a, 28a.

The transfer mold material is injected into the mold cavity 67 through aconventional longitudinally disposed runner 68a and a transverselydisposed gate 68b in a well known manner, so as to completelyencapsulate the capacitor 18, embed the major parts of the horizontalleg portions of the terminals 26-29, and at least the central portion61a of the optional heat sink 61, if employed. For the molding operationdescribed, the gate would preferably have a thickness defined by thewidth of the strip stock carrier 33.

After the molding operation, any thin webs of plastic (flash) that aretypically formed along various parting line-defined sections of themolded housing (in the plane of the unbent terminals), are easilyremoved, preferably by a conventional grit blasting operation. It isalso apparent, of course, that the terminals 26-29, and the end portions61b, 61c of the optional heat sink, if employed, may be bent into theirfinal configurations, as illustrated in FIG. 1, at any time after themolding operation.

While only one transfer injection runner and gate have been illustratedin FIG. 3, in an automated system it may be advantageous to inject themolding material into the mold cavity from opposite sides thereof. It isalso understood, of course, that a suitable vent (not shown) is normallyemployed in molds of the transfer type.

While a lead frame type of strip stock carrier 33, and a transfer mold65, have been described for use in fabricating the component module 15,the terminals could be individually blanked out of strip stock andformed, and then, as previously mentioned, a potting process could beemployed, if desired, to produce the molded encapsulating housing 21. Ifthe latter was formed by a potting operation, it is appreciated that theopen mold cavity would require suitable terminal support slots, or othersupport means, therewithin to position the terminals 26-29 until thepotting material solidified to form the housing 21.

FIGS. 6-9 illustrate another preferred embodiment of the inventionwherein a component module 70 includes a molded housing 72 within which,for purposes of illustration, is encapsulated a capacitor 74, shown onlyin phantom line form. Also supported by the housing are four uniquelyconfigured terminals 76-79. The capacitor 74 may be identical to thecapacitor 18 illustrated in the first embodiment of FIG. 1 and, as such,while not shown, may be supported and terminal-connected in the samemanner.

Considering the terminals 76-79 now more specifically, they are eachformed, preferably while an integral part of a strip stock carrier, witha DIP lead-receiving end region that is bifurcated. With particularreference to only representative terminal 77, as best seen in FIG. 7,such an end region is formed in part by a necked-down opening 77a thattapers inwardly a predetermined distance until it communicates with alaterally disposed DIP lead-receiving slot 77b.

A key-hole configured slot 77c also communicates with the lateral slot77b on the side thereof opposite the necked-down opening 77a. Thekey-hole slot results in two peculiarly formed bifurcated leg sections77d and 77e that exhibit appreciable resiliency. Thus, when thecomponent module 70 is mounted on a DIP 81, as depicted in FIGS. 8 and9, an upper horizontal, rectangularly shaped shoulder portion 82a of analigned lead 82 is easily urged, with minimal force, into and,thereafter, snap-lock confined within the lateral terminal slot 77b.

The terminal 77, for purpose of illustration, represents one of the twoterminals, the other being 79, connected to different end electrodes(not seen) of the capacitor 74. As such, the respective DIP leads 82that underlie the terminals 77 and 79 illustratively represent thebattery and ground leads of the latter, for the reasons more fullydescribed above with respect to the first component module embodiment ofFIG. 1.

It is readily apparent, of course, that the degree of resiliency of thebifurcated terminal leg sections, such as 77d and 77e of representativeterminal 77, is determined not only by the size and shape of the neckeddown opening 77a, and the size and shape of the communicating key-holeslot 77c, relative to the nominal width dimension of the terminal, butby the type of material out of which the terminal is made. One preferredcommercially available material, as previously mentioned, is known asfull hard solder plated brass.

In accordance with another aspect of the component module embodiment ofFIGS. 6-9, each of the terminals is also preferably fabricated with twopre-formed solder beads 76f-79f and 76g-79g (77f and 77g being best seenin FIG. 7). These solder beads are preferably positioned on oppositesides of the longitudinal section of each key-hole slot, such as 77c,and extend along different ones of the upper edges of the lead-receivinglateral slot, such as 77b. While these solder beads are not essential ineffecting reliable soldered connnections between the DIP leads andcomponent module terminals, they are advantageously easily positioned onthe terminals by initially comprising a part of the strip stock employedto form the blanked out terminals. Such strip stock, for use as leadframe type carriers, is also commercially available from a number ofdifferent suppliers.

As best seen in FIG. 9, the solder beads on each terminal, such as onterminal 77, when re-flow soldered, establish well-defined solderfillets 91 between each terminal and the upper shoulder portion 82a ofthe DIP lead 82 interlocked therewith.

These solder connections may be effected either before or after the DIP81, with a component module 70 piggyback-mounted thereon, is positioned,as a circuit assemblage, on an associated substrate, such as a circuitboard 93 depicted in FIGS. 8 and 9. Securement of such an assemblage tothe circuit board is effected by inserting only the leads 82 of the DIP81 through the respectively aligned thru-holes 96 formed in the boardand, thereafter, soldering the leads to respeceive underside land areasor pads 97 (seen only in FIG. 9). Such solder connections, as indicatedby the solder fillet 98, may be readily effected in an automated manneras previously noted, through the use of a conventional wave solderingmachine.

It should be appreciated that while pre-formed solder beads have beenshown as part of all four terminals 76-79 in the second illustrativeembodiment, only the two chosen diagonally disposed terminals, such as77 and 79, that are to be respectively connected to the battery andground leads 82 of the DIP 81, need be soldered to the mating DIP leads.This follows from the fact that the two isolated leads, such as 76 and78 in the illustrative example, are only employed, as in the case withthe first embodiment, to facilitate the piggyback mounting of thecomponent module 70 on the top of the DIP 81. Indeed, in many circuitapplications, the component module 70 may readily be employed with onlythe two capacitor-connected terminals, such as 77 and 79, because of themanner in which they are adapted to snap-lock on the battery and groundleads of a DIP. Should the component module 70 (as well as 15) beemployed for other than a ecoupling function, or incorporate a componentother than a capacitor, it is obvious that the terminals thereof couldbe readily spaced so as to make selective contact with any desired onesof the leads of a DIP.

It is also readily apparent, of course, that since the component moduleterminals 77, 79 are secured to only the upper shoulder portions of therespectively aligned leads 82 of a DIP 81, the latter may be of the typeadapted for mounting on either a circuit board or an intermediatesocket. Regardless of how the DIPs are mounted, in many applications itmay also be desirable to stamp or otherwise imprint descriptiveinformation on the top of the housings of the fabricated componentmodules embodied herein so as to identify the type or code of theparticular DIPs on which they will be subsequently mounted.

While two preferred component module embodiments, each incorporating auniquely mounted and terminal-connected decoupling capacitor, and whichembodiments further embrace the utilization of an optional heat sink,have been disclosed herein, as well as methods for their fabrication, itis obvious that various modifications may be made to the presentillustrative claimed embodiments and methods of the invention, and thata number of alternative related embodiments and methods could be devisedby one skilled in the art without departing from the spirit and scope ofthe invention.

What is claimed is:
 1. A component module comprising:a molded housinghaving a base with four corners; a component encapsulated within saidhousing and having first and second electrodes; a first terminalincluding an upper portion having a pre-formed integral bracket meansfrictionally engaging at least a portion of said first componentelectrode, and at least partially embedded in said housing, and a lowerportion that projects downwardly from a region adjacent onepredetermined base-defined corner of said housing in close proximity tosaid first component electrode; and a second terminal including an upperportion having a pre-formed integral bracket means for frictionallyengaging at least a portion of said second component electrode, and atleast partially embedded in said housing, and a lower portion thatprojects downwardly from a region adjacent the base-defined corner ofsaid housing that is diagonally disposed from said one predeterminedfirst terminal corner thereof, the lower portion of said first andsecond terminals being spaced so as to respectively contact selectedcorrespondingly disposed leads of an associated integrated circuitpackage, having dual-in-line leads, when said component module issubsequently piggyback-mounted thereon.
 2. A component module inaccordance with claim 1 wherein said component comprises a capacitor,with said first and second electrodes being respectively accessible fromfirst and second ends thereof.
 3. A component module in accordance withclaim 1 wherein said downwardly extending lower portions of said firstand second terminals are each dimensioned so as to terminatecoextensively with an underlying lead of a circuit package when thelatter, together with said component module piggyback-mounted thereon,is connected to an associated circuit substrate.
 4. A component modulein accordance with claim 1 wherein the lower portion of each of saidfirst and second terminals is formed with a resilient, bifurcated endregion, said end region defining two laterally spaced and resilient legsections that are configured to form a necked-down opening therebetweenwhich communicates with a laterally disposed slot that is also formed bysaid leg sections, said slot being wider than the narrowest inner widthof said opening immediately adjacent thereto, and also being dimensionedso as to allow a shoulder portion of a rectangularly shaped circuitpackage lead to be readily snapped therein after having been forcedthrough said communicating opening.
 5. A component module in accordancewith claim 4 wherein at least one pre-formed solder bead is mountedadjacent the slot in each of said bifurcated terminals for soldering theends of said bifurcated terminals to respective associated leads of acircuit package when brought into interlocked engagement therewith.
 6. Acomponent module in accordance with claim 1 further including a heatsink having a central planar portion positioned beneath said component,and embedded in said housing; and outer exposed portions located outsideof, and projecting from, said housing.
 7. A component module inaccordance with claim 1 further comprising third and fourth terminals,electrically isolated from said first and second component electrodes,and each having an upper end portion at least partially embedded in saidhousing, and a lower end portion that projects downwardly from a regionadjacent a different one of the base-defined corners of said housing notassociated with said first and second terminals, the lower portions ofsaid third and fourth terminals being spaced so as to respectivelyengage different leads of a circuit package when said component moduleis mounted thereon and, thereby, facilitate the positioning of saidcomponent module on said circuit package.
 8. A component modulecomprising:a mold housing having a rectangularly shaped base; acapacitor encapsulated within said housing and having first and secondopposite end electrodes; a first terminal including an upper leg portionin contact with said first capacitor electrode, and at least partiallyembedded in said housing, and a lower leg portion that projectsdownwardly from a region adjacent a first base-defined corner of saidhousing in close proximity to said first capacitor electrode; a secondterminal projecting downwardly from a region adjacent a secondbase-defined corner of said housing in close proximity to said firstcapacitor electrode, and having an upper end region embedded in saidhousing, but electrically isolated from both said first and secondcapacitor electrodes; a third terminal including an upper leg portion incontact with said second capacitor electrode, and at least partiallyembedded in said housing, and a lower leg portion that projectsdownwardly from a region adjacent a third base-defined corner of saidhousing, in close proximity to said second electrode said third cornerbeing diagonally disposed relative to said first corner; and a fourthterminal projecting downwardly from a region adjacent a fourthbase-defined corner of said housing in close proximity to said secondcapacitor electrode, and having an upper end region embedded in saidhousing, but electrically isolated from both said first and secondcapacitor electrodes, and wherein the lower leg portions of said firstand third terminals are spaced to correspond to diagonally disposed endleads of a circuit package for piggyback-mounting the component modulethereon.
 9. A component module in accordance with claim 8 wherein saidcapacitor is of thin, rectangular configuration, and wherein said upperleg portion of each of said first and third terminals includespre-formed integral bracket means frictionally engaging at least aportion of the associated one of said first and second capacitorelectrodes.
 10. A component module in accordance with claim 8 whereinsaid downwardly extending leg portions of at least said first and thirdterminals are each dimensioned so as to terminate coextensively with anunderlying lead of a circuit package when the latter, together with saidcomponent module piggyback-mounted thereon, is connected to anassociated circuit substrate.
 11. A component module in accordance withclaim 8 wherein the lower leg portion of each of said terminals isformed with a resilient, bifurcated end region, said end region definingtwo laterally spaced and resilient leg sections that are configured toform a necked-down opening therebetween which communicates with alaterally disposed slot that is also formed by said leg sections, saidslot being wider than the narrowest inner width of said openingimmediately adjacent thereto, said slot also being dimensioned andlocated so as to allow a shoulder portion of a rectangularly shapedcircuit package lead to be forced through said necked-down opening untilsnapped into said slot.
 12. A component module in accordance with claim11 wherein at least one pre-formed solder bead is mounted adjacent theslot in each of said bifurcated component module terminals, asfabricated, so as to facilitate reflow-type soldered connections beingestablished between the ends of said bifurcated terminals andrespectively associated leads of a circuit package when brought intointerlocked engagement therewith.
 13. A component module in accordancewith claim 9 wherein at least the upper leg portions of said first andthird terminals are inwardly disposed and at least substantiallyhorizontally oriented relative to the base of said housing, and whereinsaid bracket means is of substantially C-shaped configuration.
 14. Acomponent module in accordance with claim 13 wherein the upper endregions of said second and fourth terminals define upper leg portionsthat are inwardly disposed and at least substantially horizontallyoriented relative to the base of said housing.
 15. A component module inaccordance with claim 8 wherein said capacitor electrodes are of theleaded type, and wherein said upper leg portions of each of said firstand third terminals includes pre-formed integral bracket means adaptedto receive the associated one of said first and second capacitor leads.16. A component module in accordance with claim 8 wherein the downwardlyextending sections of said second and fourth terminals define lower legportions, and wherein the lower leg portion of each of said fourterminals is formed with a resilient, bifurcated end region, said endregion defining two laterally spaced and resilient leg sections that areconfigured to form a necked-down opening therebetween which communicateswith a laterally disposed slot that is also formed by said leg sections,said slot being wider than the narrowest inner width of said openingimmediately adjacent thereto, said slot also being dimensioned andlocated so as to allow a shoulder portion of a rectangularly shapedcircuit package lead to be forced through said necked-down opening untilsnapped into said slot, each of said terminals further including asubstantially longitudinally disposed slot that communicates with, andis positioned on the side of said lateral slot opposite the necked-downopening, so as to increase the resiliency of the bifurcated leg sectionsof each terminal.
 17. A component module in accordance with claim 14further including a heat sink having at least a major planar centralportion positioned beneath said capacitor, and embedded in said housing.18. A composite circuit assemblage, comprising: an integrated circuitpackage having dual-in-line leads, each lead having an outer horizontalshoulder portion and a downwardly extending leg portion, and wherein twodiagonally disposed end leads of said circuit package comprises thebattery and ground leads thereof, respectively; anda component modulemounted on, and interconnected with the battery and ground leads of,said integrated circuit package, said component module including: amolded housing having a rectangularly shaped base; a decouplingcapacitor encapsulated within said housing and having first and secondelectrodes; a first terminal including an upper portion in contact withsaid first capacitor electrode, and at least partially embedded in saidhousing, and a lower portion that projects downwardly from a regionadjacent one predetermined base-defined corner of said housing in closeproximity to said first capacitor electrode; and a second terminalincluding an upper portion in contact with said second capacitorelectrode, and at least partially embedded in said housing, and a lowerportion that projects downwardly from a region adjacent the base-definedcorner of said housing that is diagonally disposed from said onepredetermined first terminal corner thereof, and wherein the lower endportion of each of said first and second terminals are formed with aresilient, bifurcated end region, said end region defining two laterallyspaced and resilient leg sections that are configured to form anecked-down opening therebetween which communicates with a laterallydisposed slot that is also formed by said leg sections, said slot beingwider than the narrowest inner width of said opening immediatelyadjacent thereto, said slot also being dimensioned and located so as toreceive and snap-lock confine a shoulder portion of the respectivelyaligned one of the circuit package battery and ground leads therewithin.19. A composite circuit assemblage in accordance with claim 18 wherein asoldered connection is formed between the snap-locked horizontalshoulder portion of each of said circuit package battery and groundleads and the respectively interlocked one of said first and secondterminals.
 20. A composite circuit assemblage in accordance with claim18 wherein said component module further includes a heat sink having atleast a major planar central portion that is positioned beneath saidcapacitor, and embedded in said housing.
 21. A composite circuitassemblage in accordance with claim 18 wherein said component modulefurther includes third and fourth terminals, each having an upper endportion at least partially embedded in said housing, and a lowerbifurcated portion that projects downwardly from a region adjacent adifferent one of of the base-defined corners of said housing notassociated with said first and second terminals, the lower portions ofsaid third and fourth terminals each being adapted to snap-lock confinewithin a laterally disposed slot formed therein a different horizontalshoulder portion of an aligned one of said circuit package leads.